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                    Products and Services

                    We offer a wide range of PCB products including conventional PCBs, HDI PCBs, flexible PCBs, rigid-flex PCBs, backplane assemblies, and IC substrates. We also offer value-added services to support our customers' needs.

                    TTM services also include Electro-Mechanical Solutions (E-MS). Our products in this area include sheet metal design and fabrication, backplane assembly, system integration, test and logistics for a complete solution supporting sub-system and full system integration requirements.

                    Printed Circuit Board Fabrication

                    Conventional PCB

                    • Multilayer up to 60+ layers
                    • Embedded passives
                    • Heavy copper up to 10 oz.
                    • Over 50 UL approved laminates
                    • Thickness up to 0.450"
                    • Thin core dielectrics
                    • Dimensions up to 30" x 54"
                    • Mixed dielectrics

                    HDI

                    • Up to 12L "anylayer" stacked uVia Structure
                    • 1.6 / 2.0 mil line / space
                    • Wide material and surface finish selections
                    • 14 mil, 6L ultra thin structure
                    • 3/7 mil uVia / Pad size
                    • 0.4 mm pitch BGA with 2 traces fanout
                    • Embedded, distributed and discrete passive components

                    Flex & Rigid-Flex

                    • Type 2, 3 and 4 (double sided, multilayer and rigid-flex)
                    • 30+ layers
                    • Dimensions up to 24" x 48"
                    • Acrylic, epoxy and adhesive-less polyimide flex materials
                    • Over 50 rigid material options
                    • Thickness up 0.300"
                    • Bikini cut, bookbinder and loose leaf construction
                    • Combination surface finishes
                    • Epoxy fillet

                    RF & Microwave

                    • High frequency / bandwidth designs
                    • Planar and screened resistors
                    • Dimensions up to 24" x 48"
                    • Mixed dielectrics (hybrids)
                    • Dielectric foam
                    • Conductive paste
                    • Plated cavities
                    • Formed (conformal) PCBs
                    • Optical machining

                    Thermal Management

                    • Passive and active designs
                    • Buried metal core constructions
                    • Externally mounted heatsinks
                    • Epoxy and B-stage films
                    • Thermal & conductive bonding
                    • Aluminum & copper base materials
                    • Various surface finishes
                    • In-house milling and bonding

                    IC Substrate

                    • 2,4,6 Layers (2+2+2 stacked via)
                    • BT material
                    • Wire bonding (ENEPIG, Soft gold, Hard gold)
                    • Type: SIP,CSP,BOC & FC package
                    • Fine trace width/space 25/25um
                    • Thin board: 130um(2L), 170um(4L)
                    • Flip chip C4 pad

                    Custom Assembly

                    Backplanes

                    • Dimensions up to 28" x 52"
                    • Thickness up to 0.400"
                    • Custom and Industry Standard
                    • Press-fit (compliant a€“pin)
                    • Surface mount (chip, QFP, BGA)
                    • Wave / selective solder
                    • AOI & X-ray inspection
                    • Level 2, 3 & 4 testing
                    • Conformal coating

                    Flex & Rigid-Flex

                    • Dimensions up to 22" x 52"
                    • Passive & active components
                    • Press-fit (compliant-pin)
                    • Surface mount (chip, QFP, BGA)
                    • AOI & X-ray inspection
                    • Level 2,3, & 4 testing

                    RF & Microwave

                    • Dimensions up to 22" x 34"
                    • Blind via, surface mount, thru-hole
                    • 1-piece hermetic GPO and GPPO
                    • X-ray inspection
                    • RF testing (20+ GHz)

                    Integrated Assembly

                    • Card cage through cabinet
                    • Backplanes & Midplanes
                    • Harnessing & cabling
                    • Power supplies & fan trays
                    • Peripherals & controllers
                    • I/O interfaces
                    • Functional testing
                    • Mil & Aero conduction cooled
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