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                    RF & Microwave PCBs

                    TTM applications based approach provides innovative engineering and advanced process capabilities.

                    From defense/aerospace electronics, medical devices and imaging, or complex telecommunications equipment, TTM supports a wide range of frequency bands (L, S, C, X, Ku, K, Ka, V, W). We have extensive experience with a wide range of low loss laminates and a total of over 70 resin systems.

                    Our Field Applications Engineering team provides a long history of collaborative engineering support. Qualifications include MIL-PRF-31032, AS 9100, ITAR, IPC 6012 & IPC6018, NADCAP.

                    Our Capabilities Include:

                    Tight Etch Tolerances on Critical RF Features

                    • +/- .0005" standard tolerance on etched features for unplated 0.5oz copper
                    • Selective plated up layers allowing +/- .0005" etch tolerances
                    • Exact registration/laser direct imaging
                    • Front to back registration of etched cores to +/-.001"
                    • Mixed Dielectric constructions
                    • Buried / Blind / Microvia
                    • Ormet interconnects
                    • Multilevel cavity constructions
                    • Optical mill / drill
                    • Laser routing
                    • Sequential lamination
                    • Formed PCB'S
                    • Plated edges

                    Back Drill for Precision Stub Removal

                    • Mechanical back-drilling (Minimal stub)
                    • Laser drilling (No stub)
                    • Laser modified controlled depth drill (Mechanical drill followed by laser cleanup, no stub)

                    Hole Fill

                    • Conductive, nonconductive, and partial hole fill options

                    Thermal Solutions

                    • Copper coins and slugs
                    • Metal Core & Metal Back
                    • Thermally conductive laminates
                    • Heatsink assembly department to laminate heatsink or interface plates to the circuit boards

                    Embedded Capabilities

                    • Planar Resistors
                      • Ohmega and Ticer
                      • Screened Ink Resistors
                    • Circulators
                      • On board circuit
                      • Embedded ferrites

                    Surface Finishes

                    • ENIG – electroless nickel, soft immersion gold – standard solder assemblies
                    • ENEPIG - electroless nickel, electroless palladium, immersion gold
                    • Hard and soft wirebondable gold
                    • Immersion silver

                    Assembly and Test

                    • RF assembly of connector, surface mount component, drop-in cavity components, hand and automated solder assembly options
                    • RF test center including 6 Network analyzers with combined frequency sweep coverage of 50MHz to 40GHz.
                    • Custom anechoic boxes for antenna measurements
                    • Switch matrix capability for multiple measurements between human interaction
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